SDRAM series for SiP

LAPIS Semiconductor offers KGD DRAM chips in the form of wafers, featuring quality equivalent to package products, for use in SiP (System in Package) applications. Other than the standard products, a lineup of products with an expanded temperature range that meets the requirements of automotive manufacturers is available.



Standard

Part No.

Supply
voltage
(V)

Memory
capacity
(bit)

Configu
-ration
(word×bit)

Refresh
cycle
(cycles/ms)

Max.
operating
frequency
(MHz)

Cycle
time
(ns)

Operating
temperature
Tj
(°C)

Notes

MSM56V16160J

3.3±0.3

16M

2×512K×16

4096/64

133

7.5/8/10

0 to +70

–

NEW
MSM56V16160K

3.3±0.3

16M

2×512K×16

4096/32

166

6/7/7.5/10

-40 to +125

–

NEW
MD56V62160M

3.3±0.3

64M

4×1M×16

4096/64

166

6/7/7.5/8/10

-40 to +125

–

Automotive Grade

Part No.

Supply
voltage
(V)

Memory
capacity
(bit)

Configu
-ration
(word×bit)

Refresh
cycle
(cycles/ms)

Max.
operating
frequency
(MHz)

Cycle
time
(ns)

Operating
temperature
Tj
(°C)

Notes

NEW
MSM56V16160K

3.3±0.3

16M

2×512K×16

4096/32

166

6/7/7.5/10

-40 to +125

–

NEW
MD56V62160M

3.3±0.3

64M

4×1M×16

4096/64

143

6/7/7.5/8/10

-40 to +125

–

*For details of automotive products, please contact the sales.