商品明細

4170-IH

料號：4170-IH

商品詳細介紹Product Introduction

4170-IH

We, Tesec is now introducing the new Map handler model 4170-IH that is for the direct test of the leadless QFN, CSP devices after dicing on the wafer. As the device testing is on the wafer ring, and devices positioning（x y z θ）compensation before testing by the visual check system, the high accuracy of the devices positioning information and the suitable probe-pin contact pressure are maintained for the stable testing and high speed indexing. This new model is upgraded as a succeeding machine of the previous model 3270-IH that improved the transfer accuracy and increased the width stand load of the test section table, also able to handle the WLCSP as well as comply to multi-testing site and simultaneous (parallel) testing.

Specifications
Model	4170-IH
Applicable device	QFN, DFN, CSP, BGA, BCC, LLP, WLCSP
Applicable ring sizes	8 / 12 inches
Contact method	Pogo-pin or specified contactor
Supply ring capacity	1 cassette(Wafer ring 25 pcs/8 inches, 13 pcs/12 inches)
Stock ring capacity	1 cassette(Wafer ring 25 pcs/8 inches, 13 pcs/12 inches)

FEATURES

High throughput
High withstand load, and high thrust table
Expansion of the strip attachment area：260(L) X 300(W) [Withinφ300mm for WLCSP]
LOT control by barcode/2D code reader
Easy device type exchange only test socket and display screen setting
Auto-cleaning function unit is installed to clean the socket at any desired timing.
8/12 inches ring conversion
S2/S8 regulation compliance
SEMI G85 compliance
SECS/GEM compliance

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