商品明細

We, Tesec is now introducing the new Map handler model 4170-IH that is for the direct test of the leadless QFN, CSP devices after dicing on the wafer. As the device testing is on the wafer ring, and devices positioning（x y z θ）compensation before testing by the visual check system, the high accuracy of the devices positioning information and the suitable probe-pin contact pressure are maintained for the stable testing and high speed indexing. This new model is upgraded as a succeeding machine of the previous model 3270-IH that improved the transfer accuracy and increased the width stand load of the test section table, also able to handle the WLCSP as well as comply to multi-testing site and simultaneous (parallel) testing.