Contact plating is one of the most critical processes in reed switch manufacturing, and it greatly affects reed switch characteristics. In automatic plating equipment, the steps of the process (pre-treatment, underplating, contact plating, cleaning and drying) are controlled by computer so that plating is applied with high-precision. This automatic plating equipment was developed by OSDC, and is one of the key factors behind our high-quality reed switches.
In order to deactivate the rhodium-plated contact, we have developed a unique high temperature oxygen treatment. This technique makes the organic impurities built on the surface burned with oxygen and forms oxygen molecule layer on the contact which in turn provide stable contact resistance. This unique method won the highest prize (Schneider Award) at the 21st National Relay Conference in Oklahoma, USA, in 1973. Our technology is valued highly, and at the 36th and 38th Annual National Relay Conference we also received the Schneider Awards for research on reed switch contact surface phenomena.
Our patents have been registered in Japan (Pat. No. 916386), USA (Pat. No. 3857175) and Germany (Pat. No. 2303587).